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μ PG2163T5N
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RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods
and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Partial Heating
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ° C or higher
Preheating time at 120 to 180 ° C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 260 ° C or below
: 10 seconds or less
: 60 seconds or less
: 120 ± 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 350 ° C or below
: 3 seconds or less
: 0.2%(Wt.) or below
IR260
HS350
Caution Do not use different soldering methods together (except for partial heating).
R09DS0019EJ0300 Rev.3.00
May 19, 2011
Page 7 of 8
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